June 8, 2026·Bullish·tech development

NVIDIA Tests Intel 18A Process for Feynman GPU

NVIDIA is reportedly testing Intel's 18A manufacturing process and EMIB packaging technology for its next-generation Feynman processor. The main GPU compute die will remain with TSMC, but Intel could gain a foothold in advanced packaging for the chip.

Detected & updated continuously · Source: Ruma

Mentioned

INTEL (INTC)

NVIDIA (NVIDIA)

TSMC (TSMC)

Sources

@StockSavvyShay

$NVDA is reportedly testing $INTC 18A process and EMIB packaging for its next-gen Feynman processor. The main GPU compute die would still stay with $TSM but Intel could win share in advanced packaging and I/O where capacity is becoming a real bottleneck https://t.co/grmaTBZzMi